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| FUJITSU SEMICONDUCTOR DATA SHEET PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC BGA-320P-M06 320-pin plastic PBGA Lead pitch Package width x package length Lead shape Sealing method Mounting height Weight 1.27 mm 27.00 mm x 27.00 mm Ball Plastic mold 2.46 mm Max 2.90 g (BGA-320P-M06) 320-pin plastic PBGA (BGA-320P-M06) B A 27.00(1.063) 24.000.10(.945.004) 1.44 (.057) 24.13(.950) 0.635 (.025) 1.27 (.050) 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 YW V U T R P NM L K J H G F E D C B A 1.27 (.050) 27.00 (1.063) 24.000.10 (.945.004) INDEX 24.13 (.950) 0.635 (.025) 1.44 (.057) 0.20(.008) (4X) o0.750.15(.030.006) o0.30(.012) M C A B o0.15(.006) M C C 0.15(.006) C 1.660.10 (.065.004) 2.46(.097) MAX. 0.35(.014) MIN. C 2006 FUJITSU LIMITED BGA320006S-c-2-1 Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0612 |
Price & Availability of BGA-320P-M06
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